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正翻译步骤 5

步骤 5
Preheat the oven to 385F (195C).
Oven Preperation
  • Preheat the oven to 385F (195C).

  • Experiment with lower heats first, and increase temperature as necessary.

  • If you've already finished this guide once and are baking again, increase the temperature slightly - 395F (200C) or 400F (205C).

  • Most of these temporary repairs only consist of the expanding/shrinking of bumps under the surface mount of the graphics chip. Therefore, a lower heat may work as well.

预热烤箱至195°C(385°F)。

先尝试使用较低的温度,需要的时候再调高。

如果你已经按操作进行过一次了然后准备再来一次,稍微提高温度——200°C(395°F)或者205°C(400°F)。

大多数这类临时维修只是让核心下的焊点热胀冷缩,并非完全熔化,所以低一点的温度可能也行。

-[title] preparing the oven
+[title] Oven Preperation
[* black] Preheat the oven to 385F (195C).
-[* black] If you've already finished this guide once and are baking again, increase the temperature slightly -- 395F (200C) or 400F (205C).
-[* icon_note] Solder melts at different temperatures depending on the type, so if you're squeamish, you might start at 375F.
-[* black] Due to new information - most of these temporary repairs are only expanding/shrinking of bumps under the graphics chip surface-mount, so lower heat might work too.
+[* icon_note] Experiment with lower heats first, and increase temperature as necessary.
+ [* icon_note] If you've already finished this guide once and are baking again, increase the temperature slightly - 395F (200C) or 400F (205C).
+[* black] Most of these temporary repairs only consist of the expanding/shrinking of bumps under the surface mount of the graphics chip. Therefore, a lower heat may work as well.

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