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正翻译步骤 2

步骤 2
Once all the screws are removed, slowly and carefully lift off the back plate. Do this by inserting a spudger between the front and back plates of the device on both sides of the phone. Once back plate is lifted, the small, silver volume and camera buttons located on the sides of the device will fall off. They are only connected to the phone by the back plate. Remove and do not lose these pieces. Locate the cover of the head phone jack. The cover is silver and circular and has a headphone image on the front of it. Open the cover to the headphone jack and peel it off the device. Do not lose this piece.
  • Once all the screws are removed, slowly and carefully lift off the back plate. Do this by inserting a spudger between the front and back plates of the device on both sides of the phone.

  • Once back plate is lifted, the small, silver volume and camera buttons located on the sides of the device will fall off. They are only connected to the phone by the back plate. Remove and do not lose these pieces.

  • Locate the cover of the head phone jack. The cover is silver and circular and has a headphone image on the front of it. Open the cover to the headphone jack and peel it off the device. Do not lose this piece.

  • Be careful when taking the shell apart, as the wire that connects the external speaker and the logic board can break if too much force is applied.

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