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正翻译步骤 16

Step 16
The RF Module board detaches outward from the lower case. The back of the RF Module board features one lone IC from Info Storage Devices labeled 9160F1MS03 1327 2317B057. We believe this is an Audio User Interface chip from Nuvoton. The back of the RF Module board features one lone IC from Info Storage Devices labeled 9160F1MS03 1327 2317B057. We believe this is an Audio User Interface chip from Nuvoton.
  • The RF Module board detaches outward from the lower case.

  • The back of the RF Module board features one lone IC from Info Storage Devices labeled 9160F1MS03 1327 2317B057. We believe this is an Audio User Interface chip from Nuvoton.

红外模块和主板分离,固定在金属中框外面。

红外模块的背面只有一个芯片,我们认为应该是 Nuvoton 的音频用户界面芯片

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