跳转到主内容

注:你正在编辑的一份前提条件指南。你所做的任何更改将影响包括此步骤的2指南

英语
中文

正翻译步骤 4

步骤 4
It may be necessary to soften the thermal paste between the logic board and heat sink. You can soften the thermal compound using a hairdryer. Move the hairdryer back and forth over the ribbed metal section of the heat sink for one minute. At this point, the heat sink should come free easily.
  • It may be necessary to soften the thermal paste between the logic board and heat sink. You can soften the thermal compound using a hairdryer. Move the hairdryer back and forth over the ribbed metal section of the heat sink for one minute. At this point, the heat sink should come free easily.

  • Use a spudger to pry the heat sink up on the left side, near the hard drive.

在此插入翻译

在此插入翻译

在开源创作共享许可协议下,你的投稿已被许可