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正翻译步骤 28

步骤 28
Gently separate lower logic board from mid chassis. The lower logic board is held to the mid chassis by copious amounts of strong adhesive. Gently separate lower logic board from mid chassis. The lower logic board is held to the mid chassis by copious amounts of strong adhesive.

  • Gently separate lower logic board from mid chassis. The lower logic board is held to the mid chassis by copious amounts of strong adhesive.

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