正翻译步骤 10
步骤 10


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Fair warning, there were some minor casualties in today's board delamination. A little slip of the knife at 300° C is all it took to smear some of these chips right off the board. We blame our robot intern. Here are some of the bits he managed to salvage:
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128 GB of Kioxia NAND flash memory
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ST Microelectronics STB601A power management IC
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Qualcomm's SDR865 5G and LTE transceiver, SDX55M 5G modem-RF system, and SMR526 intermediate frequency IC
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USI 339S00761 WLAN / Bluetooth module
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Avago 8200 high/mid-band power amplifier with integrated duplexer
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Murata 1XR-482 mmWave front-end module