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注:你正在编辑的一份前提条件指南。你所做的任何更改将影响包括此步骤的4指南

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正翻译步骤 2

步骤 2
Insert an opening tool between the back cover and the metal housing. Twist the opening tool to create a wider gap.
Wedge open the back cover
  • Insert an opening tool between the back cover and the metal housing.

  • Twist the opening tool to create a wider gap.

  • Don't fully remove the back cover just yet. The sensor flex cable is still connected to the motherboard.

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