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苹果手表 Series 6 拆解

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正翻译步骤 6

步骤 6
Apple Watch Series 6 Teardown: 步骤 0 中的图像 1，3 Apple Watch Series 6 Teardown: 步骤 0 中的图像 2，3 Apple Watch Series 6 Teardown: 步骤 0 中的图像 3，3

  • Like most brains, the grey matter in this Series 6 is pretty inscrutable: it's encased in hardened resin, as per usual, making further exploration extremely difficult.

  • Update: Unless you have an X-ray machine, that is! Here's an inside look at the S6 package. If you're wondering what all the tiny shapes are, check out the original Apple Watch X-ray teardown for an explainer.

  • There are a few more conventional ICs piggybacked onto the package, and we can at least spot a Skyworks chip marked 239-7. The other chips are more mysterious, and none is an exact match for the U1 chip we found in last year's iPhones.

  • It was probably too much to ask for a labeled U1 package, but there has been more obvious printing in the past.

  • Sans-brains, we can see the Series 6 frame has a slightly modified footprint with a narrower lip for the adhesive gasket, which is now carefully routed around the band mechanism.

  • The modified case and lack of Force Touch gasket probably accounts for the fact that this year's model is a hair thinner, with overall thickness at 10.4 mm (down from 10.74 mm last year).

  • Apple somehow packed more battery and more Taptic Engine into a (barely) smaller design. Impressive!

像大多数人的大脑一样，第6系列中的灰色物质非常难以理解：按照惯例，它被包裹在硬化树脂中，这使得进一步探索变得极为困难。

更新：除非你拥有X光机，否则！这是S6软件包的内部视图。如果您想知道所有微小的形状是什么，请查看原始的Apple Watch X射线拆解以得到解释。

配装上还有更多常规IC，我们至少可以找到标有239-7的Skyworks芯片。其他芯片则更加神秘，没有一款与我们去年iPhone中发现的U1芯片完全匹配。

要求带有标签的U1包装可能太多了，但是在过去，这种印刷方式更为明显。

不用想，我们可以看到Series 6框架的占用空间略有变化，而粘性垫圈的唇缘更窄，现在可以仔细地绕着带子机构布线。

修改后的外壳和缺少Force Touch垫圈的原因可能是以下事实：今年的模型更细，总厚度为10.4毫米（去年为10.74毫米）。

苹果以某种方式将更多的电池和更多的Taptic Engine包装到了（几乎）较小的设计中。令人印象深刻！

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