正翻译步骤 7
步骤 7
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Thank you, Samsung, for making these motherboards look like AT-ATs. We expect a battle to break out on Hoth any minute now! Here's what these transports are carrying:
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Snapdragon 865+ layered under Samsung LPDDR5 RAM
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Samsung KLUDG4UHDB 128 GB universal flash storage
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Qualcomm SDX55M 5G modem-RF system and SMR526 intermediate frequency IC
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Qualcomm QDM4820, QDM5872, and QDM4870 FEMs
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NXP 11OUV2H and 9468B3, likely a part of NXP's "industry-first solution to combine UWB fine-ranging, NFC, Secure Element, and embedded SIM"
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Maxim MAX77705C PMIC
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Likely ON Semiconductor FPF3788UCX OVP load switch
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