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正翻译步骤 5

步骤 5
Scooping out this vaguely disc-shaped motherboard next, we peek under the shields and find: A Samsung SiP FO-PLP combining the Exynos 9110 dual-core, 1.15 GHz Cortex-A53 processor, their in-house 1 GB DRAM and Power Management IC The SiP FO-PLP stands for System-in-Package Fan-Out Panel Level Packaging and is Samsung’s take on getting as much tech in the tiniest package—which was already used in the original Galaxy Watch.
  • Scooping out this vaguely disc-shaped motherboard next, we peek under the shields and find:

  • A Samsung SiP FO-PLP combining the Exynos 9110 dual-core, 1.15 GHz Cortex-A53 processor, their in-house 1 GB DRAM and Power Management IC

  • The SiP FO-PLP stands for System-in-Package Fan-Out Panel Level Packaging and is Samsung’s take on getting as much tech in the tiniest package—which was already used in the original Galaxy Watch.

  • Samsung Shannon 915 Intermediate Frequency IC

  • NXP PN80T NFC controller w/ Secure Element

  • Broadcom BCM430132 WiFi/Bluetooth module and Broadcom GNSS Location Hub for GPS/GLONASS/etc

  • Qualcomm Atheros QPA5580 Power Amplifier (likely)

  • IDT P9222S wireless power receiver

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