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正翻译步骤 8

步骤 8
More chips inside this silicon sandwich include:
  • More chips inside this silicon sandwich include:

  • Qualcomm PM8150 power management IC

  • Qualcomm WCD9341 audio codec

  • 2MIWO4

  • Samsung S2DOS04 DC-DC converter (likely for the backlight)

  • Qualcomm QDM3870 RF front-end module

  • Samsung S2MPB02 power management IC

  • Likely a Texas Instruments TAS2xxx audio amplifier

更多的芯片夹在硅制成的三明治中,包括了:

高通PM8150电源管理IC

高通WCD9341音频编解码器IC

2MIWO4

DOS04 09Y44E W1948(可能是背光IC)

高通QDM3870射频前端模块

[* black] More chips inside this silicon sandwich include:
- [* red] Qualcomm PM8150 power management ICs
- [* orange] Qualcomm WCD9341 audio codec IC
+ [* red] Qualcomm PM8150 power management IC
+ [* orange] Qualcomm [link|https://www.qualcomm.com/products/wcd9341|WCD9341|new_window=true] audio codec
[* yellow] 2MIWO4
- [* green] DOS04 09Y44E W1948 (likely a backlight IC)
+ [* green] Samsung S2DOS04 DC-DC converter (likely for the backlight)
[* light_blue] Qualcomm QDM3870 RF front-end module
+ [* blue] Samsung S2MPB02 power management IC
+ [* violet] Likely a Texas Instruments TAS2xxx audio amplifier

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