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正翻译步骤 7

步骤 7
Digging out the motherboard we spy some serious shielding strategy—what treasures could these caps cover? Qualcomm SDM710 Snapdragon 710 processor Samsung KM2V7001CM 6 GB LPDDR4 memory and 128 GB storage package
  • Digging out the motherboard we spy some serious shielding strategy—what treasures could these caps cover?

  • Qualcomm SDM710 Snapdragon 710 processor

  • Samsung KM2V7001CM 6 GB LPDDR4 memory and 128 GB storage package

  • Skyworks SKY 78185-11 Low Band 2G/3G/4G Module

  • Skyworks SKY 78187-11 High Band 2G/3G/4G Module

  • SDR660 003 radio frequency IC

  • Qualcomm PM670 & PM670A power management ICs

  • Qualcomm WCN3990 WiFi 802.11ac, Bluetooth LE, and FM SoC

Nell'estrarre la scheda madre, individuiamo alcune serie strategie di schermatura; quali tesori si nasconderanno sotto queste cover?

Processore Qualcomm SDM710 Snapdragon 710

6 GB di memoria LPDDR4 Samsung KM2V7001CM e 128 GB di memorizzazione interna

Modulo 2G/3G/4G Low Band Skyworks SKY 78185-11

Modulo 2G/3G/4G High Band Skyworks SKY 78187-11

IC radiofrequenza SDR660 003

Chip gestione alimentazione Qualcomm PM670 & PM670A

SoC Qualcomm WCN3990 - WiFi 802.11ac, Bluetooth LE e FM

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