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修复你的物品

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正翻译步骤 2

步骤 2
Place the motherboard on the specialized Heating Platform. With temperature of the platform reaching 140℃, insert the prying knife between the upper layer and the third space PCB.
Motherboard Separating
  • Place the motherboard on the specialized Heating Platform. With temperature of the platform reaching 140℃, insert the prying knife between the upper layer and the third space PCB.

  • With the whole upper layer being loose, pick up the upper layer with tweezers. Continue to take the lower layer off the platform.

在此插入翻译

在此插入翻译

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