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正翻译步骤 10

步骤 10
Back at the tail end of the AirPod, we disconnect a cute little coax connector and untangle Apple's custom SiP, where the H1 and other chips live. This tiny board is even smaller than what we found last time, and probably afforded Apple a lot of extra space in the AirPods Pro compared to the standard AirPods. Try as we might, we aren't able to pry apart this package—we'll  have to take Apple at their word that it's just silicon in there, and not some form of magic.
  • Back at the tail end of the AirPod, we disconnect a cute little coax connector and untangle Apple's custom SiP, where the H1 and other chips live.

  • This tiny board is even smaller than what we found last time, and probably afforded Apple a lot of extra space in the AirPods Pro compared to the standard AirPods.

  • Try as we might, we aren't able to pry apart this package—we'll have to take Apple at their word that it's just silicon in there, and not some form of magic.

  • The backside does have a few exposed chips, but the tiny markings are too cryptic for us to identify. (If you know more than we do, hit that comment button.)

回到 AirPod 的尾部,我们断开了一个可爱的小同轴电缆连接器,并取下了Apple的定制SiP,这里面包含了H1和其他芯片。

这块电路板比我们上一次看到的更小,相比于普通的AirPods,这可能会给 AirPods Pro 带来更加充裕的空间。

我们极尽所能也没法打开这个包裹——我们只能相信苹果的话,这里面只有一些硅,而不是什么形式的魔法。

翻到背后确实能看到一些暴露的芯片,但是那些微小的标记太过隐秘了,我们无法分辨。(如果你比我们了解得更多,请点击留言按钮。)

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