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正翻译步骤 9

步骤 9
Let's open this silicon sandwich and see what lies inside: 12 GB Samsung K3UHAHADAM-AGCL LPDDR4X RAM  layered over Qualcomm Snapdragon 855 SoC
  • Let's open this silicon sandwich and see what lies inside:

  • 12 GB Samsung K3UHAHADAM-AGCL LPDDR4X RAM layered over Qualcomm Snapdragon 855 SoC

  • 256 GB Samsung KLUEG8UHDB-C2D1 eUFS 3.0 flash storage

  • Qualcomm SDX50M 5G modem

  • NXP PN80T NFC controller w/ Secure Element

  • ON Semiconductor NCP59744 voltage regulator

  • Cirrus Logic CS35L40 audio amplifiers

  • Maxim MAX77705C PMIC

让我们打开这个由硅制作成的三明治,看看里面都有什么:

12 GB Samsung K3UHAHA LPDDR4X运存堆叠在高通骁龙855系统芯片上

256 GB 三星KLUEG8UHDB eUFS 3.0闪存

高通X50 5G调制解调器

恩智浦80T17 NFC控制器

安森美半导体NCP59744稳压器

凌云CS35L40音频放大器

美信MAX77705C电源管理芯片

[* black] Let's open this silicon sandwich and see what lies inside:
- [* red] 12 GB Samsung K3UHAHA LPDDR4X RAM layered over Qualcomm [https://www.qualcomm.com/products/snapdragon-855-mobile-platform|Snapdragon 855|new_window=true] SoC
- [* orange] 256 GB Samsung KLUEG8UHDB eUFS 3.0 flash storage
- [* yellow] Qualcomm [https://www.qualcomm.com/products/snapdragon-x50-5g-modem|X50|new_window=true] 5G modem
- [* green] NXP 80T17 NFC controller
+ [* red] 12 GB Samsung K3UHAHADAM-AGCL LPDDR4X RAM layered over Qualcomm [https://www.qualcomm.com/products/snapdragon-855-mobile-platform|Snapdragon 855|new_window=true] SoC
+ [* orange] 256 GB Samsung KLUEG8UHDB-C2D1 eUFS 3.0 flash storage
+ [* yellow] Qualcomm [https://www.qualcomm.com/products/snapdragon-x50-5g-modem|SDX50M|new_window=true] 5G modem
+ [* green] NXP [link|https://media.nxp.com/news-releases/news-release-details/nxp-and-garmin-team-bring-secure-and-convenient-nfc-mobile|PN80T|new_window=true] NFC controller w/ Secure Element
[* light_blue] ON Semiconductor [https://www.mouser.com/ds/2/308/NCP59744-D-364288.pdf|NCP59744|new_window=true] voltage regulator
[* blue] Cirrus Logic CS35L40 audio amplifiers
[* violet] Maxim MAX77705C PMIC

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