正翻译步骤 9
步骤 9
-
Let's open this silicon sandwich and see what lies inside:
-
12 GB Samsung K3UHAHADAM-AGCL LPDDR4X RAM layered over Qualcomm Snapdragon 855 SoC
-
256 GB Samsung KLUEG8UHDB-C2D1 eUFS 3.0 flash storage
-
Qualcomm SDX50M 5G modem
-
NXP PN80T NFC controller w/ Secure Element
-
ON Semiconductor NCP59744 voltage regulator
-
Cirrus Logic CS35L40 audio amplifiers
-
Maxim MAX77705C PMIC
您的所有投稿皆享有基于开源创作共享许可协议(CC BY-NC-SA)的著作权利。