跳转到主内容
英语
中文

正翻译步骤 6

步骤 6
Finally, we get to the nitty-gritty of this Mate's iteration—the motherboard: Micron D9WGR (MT53D1G64D8NZ-046 WT:E) 8 GB LPDDR4 with Kirin 980 SoC layered underneath Toshiba THGAF8T1T83BAIR 256 GB NAND flash
  • Finally, we get to the nitty-gritty of this Mate's iteration—the motherboard:

  • Micron D9WGR (MT53D1G64D8NZ-046 WT:E) 8 GB LPDDR4 with Kirin 980 SoC layered underneath

  • Toshiba THGAF8T1T83BAIR 256 GB NAND flash

  • Samsung K4UHE3D4AA-CGCJ 3 GB LPDDR4X—more on that later

  • Skyworks 78191-11 low-band front-end module for WCDMA/LTE

  • HiSilicon Hi6526 PMU

  • NXP 80T37 (likely NFC controller)

  • For comparison, the smaller board on the lower left belongs to the Mate 20 Pro.

最后,我们了解了这个 Mate 的迭代 ——主板的细节:

美光D9WGR(MT53D1G64D8NZ-046 WT:E)8 GB LPDDR4,下面分层有麒麟980 SoC

东芝THGAF8T1T83BAIR 256 GB NAND闪存

三星 K4UHE3D4AA-CGCJ LPDDR4X

Skyworks 78191-11用于WCDMA / LTE的低频前端模块

HiSilicon Hi6526 PMU

恩智浦80T37(可能是NFC控制器)

相比之下,左下方较小的板属于Mate 20 Pro。

在开源创作共享许可协议下,你的投稿已被许可