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正翻译步骤 12

Step 12
No new tricks here, either. Removing the motherboard requires no more than a spudger and a Phillips #0 screwdriver. Most components in the Hero3 use very little power and generate minimal heat. This light coating of thermal compound on the image processor is the most aggressive cooling feature in the device. Most components in the Hero3 use very little power and generate minimal heat. This light coating of thermal compound on the image processor is the most aggressive cooling feature in the device.
  • No new tricks here, either. Removing the motherboard requires no more than a spudger and a Phillips #0 screwdriver.

  • Most components in the Hero3 use very little power and generate minimal heat. This light coating of thermal compound on the image processor is the most aggressive cooling feature in the device.

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