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正翻译步骤 10

步骤 10
Lifting from the top edge, swing the logic board upwards to a 45° angle to ensure all adhesive beneath is separated. Use a spudger or opening pick to separate any remaining adhesive as needed.
  • Lifting from the top edge, swing the logic board upwards to a 45° angle to ensure all adhesive beneath is separated.

  • Use a spudger or opening pick to separate any remaining adhesive as needed.

在此插入翻译

在此插入翻译

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