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意大利语

正翻译步骤 10

步骤 10
Lifting from the top edge, swing the logic board upwards to a 45° angle to ensure all adhesive beneath is separated. Use a spudger or opening pick to separate any remaining adhesive as needed.
  • Lifting from the top edge, swing the logic board upwards to a 45° angle to ensure all adhesive beneath is separated.

  • Use a spudger or opening pick to separate any remaining adhesive as needed.

Sollevando il bordo superiore della scheda, ruotala di circa 45° per assicurarti che tutto l'adesivo sottostante si sia separato.

Usa uno spudger o un plettro per rimuovere tutto l'adesivo rimasto se necessario.

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