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正翻译步骤 12

步骤 12
Double the phone, double the fun! Found on the right side's main board: Samsung K3UHAHA0AM-AGCL 12 GB RAM layered over Qualcomm Snapdragon 855
  • Double the phone, double the fun! Found on the right side's main board:

  • Samsung K3UHAHA0AM-AGCL 12 GB RAM layered over Qualcomm Snapdragon 855

  • Samsung KLUFG8RHDA-B2D1 512 GB eUFS NAND flash storage

  • Qorvo QM78062, likely a RF Fusion front-end module

  • Qualcomm SDR8150 RF transceiver

  • Murata KM9705076 front end module (likely)

  • Maxim MAX77705C PMIC

  • IDT P9320S Wireless charging IC

双倍的手机,双倍的快乐!让我们来看看右侧主板有什么东西吧:

三星K3UHAHA 12 GB RAM其下方则为高通骁龙 855

三星(Samsung)KLUFG8RHDA-B2D1 512 GB eUFS闪存

Qorvo 78062 可能是射频融合(RF Fusion)模块

高通 SDR8150

Murata KM9705076

Maxim MAX77705C 电源管理集成电路

IDT P93205

[* black] Double the phone, double the fun! Found on the right side's main board:
[* red] Samsung K3UHAHA[link|https://www.samsung.com/semiconductor/dram/lpddr4x/K3UHAHA0AM-AGCL/|K3UHAHA0AM-AGCL] 12 GB RAM layered over Qualcomm Snapdragon 855
[* orange] Samsung KLUFG8RHDA-B2D1 512 GB eUFS NAND flash storage
[* yellow] Qorvo 78062QM78062, likely a [https://www.qorvo.com/applications/mobile-products/rf-fusion|RF Fusion|new_window=true] front-end module
[* green] Qualcomm SDR8150 RF transceiver
[* light_blue] Murata KM9705076 front end module (likely)
[* red] Samsung K3UHAHA[link|https://www.samsung.com/semiconductor/dram/lpddr4x/K3UHAHA0AM-AGCL/|K3UHAHA0AM-AGCL] 12 GB RAM layered over Qualcomm Snapdragon 855
[* orange] Samsung KLUFG8RHDA-B2D1 512 GB eUFS NAND flash storage
[* yellow] Qorvo 78062QM78062, likely a [https://www.qorvo.com/applications/mobile-products/rf-fusion|RF Fusion|new_window=true] front-end module
[* green] Qualcomm SDR8150 RF transceiver
[* light_blue] Murata KM9705076 front end module (likely)
[* blue] Maxim MAX77705C PMIC
[* violet] IDT P93205P9320S Wireless charging IC
[* violet] IDT P93205P9320S Wireless charging IC

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