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注:你正在为你刚才查阅的指南编辑前提条件。你所做的任何更改将影响包括此步骤的14本指南

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正翻译步骤 5

步骤 5
Slide the opening pick down the side of the phone, separating the adhesive. Go slowly so that the tool doesn't slip out of the seam. If cutting becomes difficult, reheat and reapply the iOpener.
  • Slide the opening pick down the side of the phone, separating the adhesive.

  • Go slowly so that the tool doesn't slip out of the seam. If cutting becomes difficult, reheat and reapply the iOpener.

将撬片或 Halberd 撬棒的刀片沿着手机侧面滑下,分离粘合剂。

缓慢移动,以免工具从接缝中滑出。 如果切割变得困难,请重新加热并重新使用iOpener(软化粘合剂)。

-[* black] Slide an opening pick or the blade of a Halberd spudger down the side of the phone, separating the adhesive.
+[* black] Slide the opening pick down the side of the phone, separating the adhesive.
[* icon_note] Go slowly so that the tool doesn't slip out of the seam. If cutting becomes difficult, reheat and reapply the iOpener.

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