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正翻译步骤 11

步骤 11
We're starting to see a trend here. Getting the next layer out of this case requires—you guessed it—heaps of heat, a plethora of prying, and a pair of pliers. We immediately notice that this generation's logic board is more ... goopier ... than the board that emerged from the wreckage of the first AirPod fiasco—probably to help with water resistance. Finally, a beacon in the darkness—there's still a modular charging port!
  • We're starting to see a trend here. Getting the next layer out of this case requires—you guessed it—heaps of heat, a plethora of prying, and a pair of pliers.

  • We immediately notice that this generation's logic board is more ... goopier ... than the board that emerged from the wreckage of the first AirPod fiasco—probably to help with water resistance.

  • Finally, a beacon in the darkness—there's still a modular charging port!

  • ... although if you tunnel this far into the case, there's a good chance you now have more broken parts than just the charging port.

  • Beneath that shiny liquid-resistant coating, we make out some chips:

  • Broadcom 59356A2KUBG wireless charging module

  • L476MGY6 A5

  • TI 87A6FP

我们已经看到了接下来拆解的趋势。让这盒子的下一层出来的办法——大量的热量,需要撬动很多次和一把钳子。

我们马上注意到这一代的主板和我们从第一代 AirPods 残骸中的主板更加的……粘,可能有助于防水。

最后,黑暗中的灯塔——这里仍有一个模块化充电接口。

即使到了这一步,这也是件好事,现在你除了充电接口还有了更多的零件。

在闪亮的防水涂层下面,我们识别出一些芯片:

博通(Broadcom)59356A2KUBG 无线充电模块

L476MGY6 A5

德州仪器(TI) 87A6FP

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