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正翻译步骤 11

步骤 11
We're starting to see a trend here. Getting the next layer out of this case requires—you guessed it—heaps of heat, a plethora of prying, and a pair of pliers. We immediately notice that this generation's logic board is more ... goopier ... than the board that emerged from the wreckage of the first AirPod fiasco—probably to help with water resistance. Finally, a beacon in the darkness—there's still a modular charging port!
  • We're starting to see a trend here. Getting the next layer out of this case requires—you guessed it—heaps of heat, a plethora of prying, and a pair of pliers.

  • We immediately notice that this generation's logic board is more ... goopier ... than the board that emerged from the wreckage of the first AirPod fiasco—probably to help with water resistance.

  • Finally, a beacon in the darkness—there's still a modular charging port!

  • ... although if you tunnel this far into the case, there's a good chance you now have more broken parts than just the charging port.

  • Beneath that shiny liquid-resistant coating, we make out some chips:

  • Broadcom BCM59356A2KUBG wireless charging module

  • STMicroelectronics STM32L476MG 32-Bit ARM Cortex-M4 microcontroller w/ 1 Mb flash

  • TI 87A6FP

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