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正翻译步骤 11

步骤 11
We're starting to see a trend here. Getting the next layer out of this case requires—you guessed it—heaps of heat, a plethora of prying, and a pair of pliers. We immediately notice that this generation's logic board is more ... goopier ... than the board that emerged from the wreckage of the first AirPod fiasco—probably to help with water resistance. Finally, a beacon in the darkness—there's still a modular charging port!
  • We're starting to see a trend here. Getting the next layer out of this case requires—you guessed it—heaps of heat, a plethora of prying, and a pair of pliers.

  • We immediately notice that this generation's logic board is more ... goopier ... than the board that emerged from the wreckage of the first AirPod fiasco—probably to help with water resistance.

  • Finally, a beacon in the darkness—there's still a modular charging port!

  • ... although if you tunnel this far into the case, there's a good chance you now have more broken parts than just the charging port.

  • Beneath that shiny liquid-resistant coating, we make out some chips:

  • Broadcom BCM59356A2KUBG wireless charging module

  • STMicroelectronics STM32L476MG 32-Bit ARM Cortex-M4 microcontroller w/ 1 Mb flash

  • TI 87A6FP

Iniziamo a notare una certa tendenza progettuale. Arrivare allo strato successivo di questa custodia richiede, come avrai già indovinato, calore applicato a iosa, un gran lavoro con strumenti di leva e l'uso di pinze.

Notiamo subito che la scheda logica di questa nuova generazione e più, diciamo, viscida della scheda emersa dal relitto del primo fallimento con l'AirPod, probabilmente per favorire la resistenza all'acqua.

E ora finalmente una luce appare nell'oscurità: c'è ancora una porta di ricarica modulare!

...certo, se sei arrivato a questa profondità nella custodia, ci sono buone probabilità che tu a questo punto ti ritrovi con molte altre cose rotte oltre alla porta di ricarica.

Sotto questo lucido rivestimento resistente all'acqua, troviamo alcuni chip:

Modulo di ricarica wireless Broadcom 59356A2KUBG

L476MGY6 A5

TI 87A6FP

[* black] We're starting to see a trend here. Getting the next layer out of this case requires—you guessed it—heaps of heat, a plethora of prying, and a pair of pliers.
[* black] We immediately notice that this generation's logic board is more ... goopier ... than the [guide|75578|board|stepid=152781|new_window=true] that emerged from the wreckage of the first AirPod fiasco—probably to help with water resistance.
[* black] Finally, a beacon in the darkness—there's [guide|75578|still|stepid=152780|new_window=true] a modular charging port!
[* black] ... although if you tunnel this far into the case, there's a good chance you now have more broken parts than just the charging port.
[* black] Beneath that shiny liquid-resistant coating, we make out some chips:
- [* red] Broadcom 59356A2KUBG wireless charging module
- [* orange] L476MGY6 A5
+ [* red] Broadcom BCM59356A2KUBG wireless charging module
+ [* orange] STMicroelectronics [link|https://www.st.com/en/microcontrollers-microprocessors/stm32l476mg.html|STM32L476MG] 32-Bit ARM Cortex-M4 microcontroller w/ 1 Mb flash
[* yellow] TI 87A6FP

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