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正翻译步骤 7

步骤 7
Taking a peek beneath the motherboard, we make a couple cool observations. That massive copper heat pipe under the board is much beefier than the one in the S9—it looks more like the one we found in the Note9. Meanwhile, we peel off an additional, multi-layer piece of thermal interface material from the board. All that copper makes a great, big, flat surface, for better thermal transfer—but it's soft metal, so you need this soft interface to fill in any gaps that might otherwise kill performance or overheat your phone.
  • Taking a peek beneath the motherboard, we make a couple cool observations.

  • That massive copper heat pipe under the board is much beefier than the one in the S9—it looks more like the one we found in the Note9.

  • Meanwhile, we peel off an additional, multi-layer piece of thermal interface material from the board. All that copper makes a great, big, flat surface, for better thermal transfer—but it's soft metal, so you need this soft interface to fill in any gaps that might otherwise kill performance or overheat your phone.

  • This thin sticker also seems to provide some RF shielding, as there's a big hole in the can lid underneath—where we find a PMIC and a big pink thermal pad.

  • TL;DR: We surmise that fast charging + reverse wireless charging puts some serious thermal stress on the electronics in this system. Samsung has pulled out all the stops to cool it off.

窥见主板下方,我们发现了一些很酷的东西。

这块巨大的铜制热管比S9内部的那块更加凶猛,相比之下更像我们在Note9内看到的那块

同时我们在主板上撕下了一个多层热界面材料,这些铜热管形成一个巨大而平坦的表面,以提供更好的导热性。但它是个柔软的金属,会与主板之间产生缝隙,这些缝隙会导致手机发热或性能下降,你需要填充他们。

这些铁氟龙胶带似乎有着一些射频屏蔽的作用,因为我们在其下方的屏蔽罩上看到了一个开孔,其中我们找到了电源管理集成电路以及一大块粉红色的导热垫

总结下来,我们推测快充和反向无线充电会让系统内部的电子器件发热严重,而三星已经在竭尽全力处理这些热量

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