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正翻译步骤 5

Step 5
Slide the opening pick from the bottom right corner along the side to the top. Apply more heat if the adhesive becomes hard to cut. During the removal process, the back cover is under tension all the time and is likely to break if the adhesive isn't softened enough. Slide the opening pick around the corner and cut the remaining adhesive at the top of the phone.
  • Slide the opening pick from the bottom right corner along the side to the top.

  • Apply more heat if the adhesive becomes hard to cut. During the removal process, the back cover is under tension all the time and is likely to break if the adhesive isn't softened enough.

  • Slide the opening pick around the corner and cut the remaining adhesive at the top of the phone.

  • Don't open the phone all the way yet. The fragile fingerprint sensor cable still connects the back cover to the motherboard.

将三角撬片从右下角沿侧面滑动到顶部。

如果粘合剂难以切割,请加热。在移除过程中,后盖始终处于张紧状态,如果粘合剂没有足够软化,则可能会破裂。

滑动拐角处的三角撬片,并切断手机顶部的剩余粘合剂。

不要一下子打开手机。易碎的指纹传感器电缆仍然将后盖连接到主板。

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