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注:你正在编辑的一份前提条件指南。你所做的任何更改将影响包括此步骤的指南

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正翻译步骤 2

步骤 2
Grab the top and bottom of the phone casing. Carefully pull the motherboard apart from the bottom casing. The circuit board should be divided into two parts.
  • Grab the top and bottom of the phone casing.

  • Carefully pull the motherboard apart from the bottom casing.

  • The circuit board should be divided into two parts.

在此插入翻译

在此插入翻译

在此插入翻译

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