跳转到主内容

注:你正在为你刚才查阅的指南编辑前提条件。你所做的任何更改将影响包括此步骤的16本指南

英语
中文

正翻译步骤 3

步骤 3
Insert a spudger underneath the shield plate along the edge of the device. Pry up to lift the shield plate up. You may feel a bit of resistance. This is normal, since the shield plate is slightly bonded to the heat sink with thermal paste.
  • Insert a spudger underneath the shield plate along the edge of the device.

  • Pry up to lift the shield plate up.

  • You may feel a bit of resistance. This is normal, since the shield plate is slightly bonded to the heat sink with thermal paste.

  • Remove the shield plate.

  • A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. For best results, whenever the shield plate is removed, refer to our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro during reassembly.

沿设备边缘在屏蔽板下方插入撬棒。

向上撬起屏蔽板。

您可能会感到有点阻力。 这是正常现象,因为屏蔽板和散热器之间有导热膏——稍微有点黏性。

取下屏蔽板。

在铜质热管和屏蔽罩之间涂有一层较厚的粉色导热硅脂。为了最好的散热效果,在移除屏蔽罩之后,最好参考我们的散热硅脂更换指南来移除旧的散热硅脂并为其更换合适厚度的硅脂,例如K5 Pro

在开源创作共享许可协议下,你的投稿已被许可