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维修的权力

配件 & 工具

注:你正在为你刚才查阅的指南编辑前提条件。你所做的任何更改将影响包括此步骤的13本指南

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正翻译步骤 2

步骤 2
Remove the shield plate from the device. A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. For best results, whenever the shield plate is removed, refer to our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro during reassembly. A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. For best results, whenever the shield plate is removed, refer to our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro during reassembly.
  • Remove the shield plate from the device.

  • A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. For best results, whenever the shield plate is removed, refer to our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro during reassembly.

将屏蔽板从主机上移除。

在铜质热管和屏蔽罩之间涂有一层较厚的粉色导热硅脂。为了最好的散热效果,在移除屏蔽罩之后,最好参考我们的散热硅脂更换指南来移除旧的散热硅脂并为其更换合适厚度的硅脂,例如K5 Pro

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