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正翻译步骤 2

步骤 2
Remove the shield plate from the device. A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. Use our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro. A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. Use our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro.
  • Remove the shield plate from the device.

  • A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. Use our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro.

将屏蔽板从主机上移除。

[* black] Remove the shield plate from the device.
[* icon_reminder] A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. Use our [guide|744|thermal paste guide|new_window=true] to remove the old thermal compound and replace it with an appropriate, thick compound such as [https://www.amazon.com/viscous-thermal-paste-replacement-Aspire/dp/B01GQ7TFTM/ref=sr_1_4?ie=UTF8&qid=1508975365&sr=8-4&keywords=k5+pro&tag=ifixitam-20|K5 Pro|new_window=true].

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