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正翻译步骤 1

步骤 1
Locate the silver strip connected to the logic board. The silver strip is closest to the bottom hinge of the phone. Wedge the plastic opening tool in between the silver strip and the logic board. Lift the plastic opening tool to separate the silver strip from the logic board.
  • Locate the silver strip connected to the logic board. The silver strip is closest to the bottom hinge of the phone.

  • Wedge the plastic opening tool in between the silver strip and the logic board.

  • Lift the plastic opening tool to separate the silver strip from the logic board.

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在此插入翻译

在此插入翻译

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