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HTC Vive Pro 拆解

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正翻译步骤 11

步骤 11
HTC Vive Pro Teardown: 步骤 0 中的图像 1,2 HTC Vive Pro Teardown: 步骤 0 中的图像 2,2

我们在背面甚至看到了更多的芯片

Cirrus Logic CS47L90高保真音频编解码器

意法半导体的F072RBH6 ARM Cortex-M0微控制器(与之前相同)

莱迪思半导体LP4K81超低功耗FPGA

Macronix MX25V8035F 8 Mb CMOS闪存

华邦25Q32JV1Q 4MB闪存

Via Labs VL210-Q4和VL813-Q7 USB 3.0控制器

Macronix MX25L4006E 4 Mb CMOS闪存

[* black] We're treated to even more chips on the back side:
[* red] Cirrus Logic [http://www.mouser.com/ds/2/76/CS47L90_F1-1019680.pdf|CS47L90|new_window=true] Hi-Fi Audio Codec
- [* orange] STMicroelectronics [http://www.st.com/en/microcontrollers/stm32f072rb.html|F072RBH6|new_window=true] ARM [https://developer.arm.com/products/processors/cortex-m/cortex-m0|Cortex-M0|new_window=true] Microcontroller (same as [guide|62213|before|stepid=130823|new_window=true])
+ [* orange] STMicroelectronics [http://www.st.com/en/microcontrollers/stm32f072rb.html|STM32F072RBH6|new_window=true] ARM [https://developer.arm.com/products/processors/cortex-m/cortex-m0|Cortex-M0|new_window=true] Microcontroller (same as [guide|62213|before|stepid=130823|new_window=true])
[* yellow] Lattice Semiconductor [http://www.latticesemi.com/~/media/LatticeSemi/Documents/DataSheets/iCE/iCE40LPHXFamilyDataSheet.pdf|LP4K81|new_window=true] Ultra Low Power FPGA
[* green] Macronix [https://datasheet.octopart.com/MX25V8035FZNI-Macronix-datasheet-101783990.pdf|MX25V8035F|new_window=true] 8 Mb CMOS flash
[* light_blue] Winbond [https://www.winbond.com/resource-files/w25q32jv%20dtr%20revf%2002242017.pdf|25Q32JV1Q|new_window=true] 4 MB flash memory
[* blue] Via Labs [https://datasheet.lcsc.com/szlcsc/VL210_C69729.pdf|VL210-Q4|new_window=true] and [https://datasheet.lcsc.com/szlcsc/VL813_C69418.pdf|VL813-Q7|new_window=true] USB 3.0 controllers
[* violet] Macronix [http://www.macronix.com/Lists/Datasheet/Attachments/6705/MX25L4006E,%203V,%204Mb,%20v1.6.pdf|MX25L4006E|new_window=true] 4 Mb CMOS flash

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