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正翻译步骤 12

Step 12
If necessary, use a spudger to pry up the left edge of the logic board to separate the solidified thermal paste from the heat sink.
  • If necessary, use a spudger to pry up the left edge of the logic board to separate the solidified thermal paste from the heat sink.

  • If any resistance is felt when prying up on the logic board, we recommend softening the thermal paste by heating the board with a hair dryer before prying further.

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