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正翻译步骤 15

步骤 15
More chips on the underside of the logic board: Qualcomm PM8018 RF power management IC
  • More chips on the underside of the logic board:

  • Qualcomm PM8018 RF power management IC

  • Hynix H2JTDG2MBR 128 Gb (16 GB) NAND flash

  • Apple 338S1131 dialog power management IC*

  • Apple 338S1117 Cirrus Logic Class D Amplifiers. The die inside is a Cirrus Logic device (second image) but it does not look like the audio codec.

  • STMicroelectronics L3G4200D (AGD5/2235/G8SBI ) low-power three-axis gyroscope—same as seen in the iPhone 4S, iPad 2, and other leading smart phones

  • Murata 339S0171 (based on Broadcom BCM4334) Wi-Fi module

更多的芯片在下面的主板

高通PM8018射频电源管理IC

海力士 H2JTDG2MBR 128gb (16gb) NAND闪存

苹果 338S1131对话电源管理IC*

苹果338S1117卷云逻辑D类放大器。里面的模具是一个卷云逻辑设备(第二张图片),但它看起来不像音频编解码器。

意法半导体L3G4200D (AGD5/2235/G8SBI)低功耗三轴陀螺仪,与iPhone 4S、iPad 2等主流智能手机相同。

Murata 339S0171(基于Broadcom BCM4334) Wi-Fi模块

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