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[* black] The flash chipstorage looks flipchipedflip-chipped onto a the substratesubstrate, with the balls aresolder points on the front side. We are taken backaback by the patterning of the balls because it is so irregularunusual, irregular pattern.
[* black] The flash chipstorage looks flipchipedflip-chipped onto a the substratesubstrate, with the balls aresolder points on the front side. We are taken backaback by the patterning of the balls because it is so irregularunusual, irregular pattern.
[* black] The experts at Creative Electron tell us that by looking at the patterning on the chip itself, focusing on the directions of the connections and vias, it looks like this flash is made of four layers—two signals, power, and ground.
[* black] Taking a closer look at the balls that connect the chip, we notice a few light-colored bubblesbubbles within. This is called voiding.
[* black] Most contacts between boards are copper. But because copper oxidizes (rusts) very quickly, you have to wash it with an acid before you makemaking the bond. This acid is called flux and is used to "wet" the tin solder. Voiding happens when the flux isn't completely cleaned off.
[* black] Taking a closer look at the balls that connect the chip, we notice a few light-colored bubblesbubbles within. This is called voiding.
[* black] Most contacts between boards are copper. But because copper oxidizes (rusts) very quickly, you have to wash it with an acid before you makemaking the bond. This acid is called flux and is used to "wet" the tin solder. Voiding happens when the flux isn't completely cleaned off.
[* black] Depending on its extent, this can be bad for durability. Clean, even connections allow heat to dissipate, while [http://creative.creativeelectron.netdna-cdn.com/wp-content/uploads/2014/10/EconomicsofLEDVoiding.compressed.pdf|voiding allows for heat build up|new_window=true], reducing the life of components.