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[* black] And here it is. The [http://en.wikipedia.org/wiki/Apple_S1|Apple S1|new_window=true] computer-on-chip. Where we were earlier thwarted, we've got a better look with some interesting analysis.
[* black] By encasing the S1 in resin, Apple was able to make use of wire bonding to make many of the connections between chips in PoP[http://en.wikipedia.org/wiki/Package_on_package|Package on Package|new_window=true] (PoP) stacks. These are incredibly small bonds, typically 10-17 microns.
[* black] By encasing the S1 in resin, Apple was able to make use of wire bonding to make many of the connections between chips in PoP[http://en.wikipedia.org/wiki/Package_on_package|Package on Package|new_window=true] (PoP) stacks. These are incredibly small bonds, typically 10-17 microns.
[* black] This saves space, as soldered packages would be thicker, but requires a whole new level of manufacturing expertise.
[* red] Here's the [guide|40655|one exposed chip|stepid=93693|new_window=true] on the S1, an STMicroelectronics gyroscope and accelerometer.