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[* black] the s1!
[* black] and some closeups, if
And here it is. The [http://en.wikipedia.org/wiki/Apple_S1|Apple S1|new_window=true] computer-on-chip. Where we have anything to say about those?
[*
were earlier thwarted, we've got a better look with some interesting analysis.
[*
black] Most ofBy encasing the S1 isin resin, Apple was able to make use of wire bonding ontoto make many of the board from flexible circuit—which is why they encapsulated itconnections between chips in resin—no solder, minimal stability.
[* black] Wire bonds
PoP stacks. These are incredibly small bonds, typically 10-17 microns, very small, very fragilemicrons.
[* black] This saves space, as soldered packages willwould be thicker, but requires a whole new typelevel of manufacturingmanufacturing expertise.
[* black] the s1!
[* black] and some closeups, if
And here it is. The [http://en.wikipedia.org/wiki/Apple_S1|Apple S1|new_window=true] computer-on-chip. Where we have anything to say about those?
[*
were earlier thwarted, we've got a better look with some interesting analysis.
[*
black] Most ofBy encasing the S1 isin resin, Apple was able to make use of wire bonding ontoto make many of the board from flexible circuit—which is why they encapsulated itconnections between chips in resin—no solder, minimal stability.
[* black] Wire bonds
PoP stacks. These are incredibly small bonds, typically 10-17 microns, very small, very fragilemicrons.
[* black] This saves space, as soldered packages willwould be thicker, but requires a whole new typelevel of manufacturingmanufacturing expertise.