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[* black] the s1!
[* black] and some closeups, if we have anything to say about those?
[* black] Most of the S1 is wire bonding onto the board from flexible circuit—which is why they encapsulated it in resin—no solder, minimal stability.
[* black] Wire bonds are typically 10-17 microns, very small, very fragile.
[* black] This saves space, as soldered packages will be thicker, but requires a whole new type of manufacturing.