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跳到步骤#15

Lauren Murphy编辑

编辑已通过 由 Adam O'Camb

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步骤行

[* black] 'The south bridge is located in the red square in the picture.
[* black] The chipset is located in the blue square in the picture. The chipset combines the north bridge and the Intel GMA 950 into one die.
[* black] The heat sink uses thermal paste and pads.
-[* black] The thermal pad in located in the green square in the picture.
+[* black] The thermal pad is located in the green square in the picture.
[* black] The thermal paste is located in the red square in the picture.