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跳到步骤#15

Elohino Theodore编辑

编辑已通过 由 Geoff Wacker

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步骤行

-[* black] The red square is around the south bridge/ ***The south bridge is located in the red square in the picture.***
-[* black] The blue square is around the chipset. the chipset combines the north bridge and Intel GMA 950 into one die. the entire chipset is called the intel 945 GM./***The chipset is located in the blue square in the picture. The chipset combines the north bridge and the Intel GMA 950 into one die.***
+[* black] 'The south bridge is located in the red square in the picture.
+[* black] The chipset is located in the blue square in the picture. The chipset combines the north bridge and the Intel GMA 950 into one die.
[* black] The heat sink uses thermal paste and pads.
-[* black] Green square is the slimy thermal pad/ ***The thermal pad in located in the green square in the picture.***
-[* black] The material in the red square is thermal paste./***The thermal paste is located in the red square in the picture.***
+[* black] The thermal pad in located in the green square in the picture.
+[* black] The thermal paste is located in the red square in the picture.