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跳到步骤#7

Robert Boyd编辑

编辑已通过 由 Robert Boyd

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步骤行

-[* black] chip id step 1
-[* red] Samsung flash storage [link|https://www.samsung.com/semiconductor/estorage/ufs/KLUDG4UHDC-B0E1/|KLUDG4UHDC-B0E1] 128 GB
-[* orange] Samsung K3LK4K40CM-BGCP 12 GB LPDDR5 RAM layered over Qualcomm
-[* yellow] Qualcomm SMR526 mobile RF transceiver, part of Qualcomm's 2nd Gen 5G chipset.
-[* green] Maxim MAX77705C power management IC
-[* light_blue] Qualcomm QPM5825 power management IC
-[* blue] Qualcomm QDM5872, QDM4820 front end module
-[* violet] Cirrus Logic CS35L40 Audio Amplifier IC
+[* black] After some de-shielding, we are able to check out just what makes this phone tick:
+ [* red] Samsung flash storage [link|https://www.samsung.com/semiconductor/estorage/ufs/KLUDG4UHDC-B0E1/|KLUDG4UHDC-B0E1] 128 GB
+ [* orange] Samsung K3LK4K40CM-BGCP 12 GB LPDDR5 RAM layered over Qualcomm
+ [* yellow] Qualcomm SMR526 mobile RF Transceiver
+ [* green] Maxim MAX77705C power management IC
+ [* light_blue] Qualcomm QPM5825 power management IC
+ [* blue] Qualcomm QDM5872 and QDM4820 Front-End Module
+ [* violet] Cirrus Logic CS35L40 Audio Amplifier IC