Introduction
Use this guide to remove the sensor array in your Samsung Galaxy S8. Included in the array is the status LED, an IR emitter, and a rangefinder.
This guide involves removing the rear glass cover, you will need replacement adhesive to reattach the back cover to the phone.
Before disassembling your phone, discharge the battery below 25%. The battery can catch fire and/or explode if accidentally punctured, but the chances of that happening are much lower if discharged.
What you need
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Heat the iOpener for thirty seconds.
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Throughout the repair procedure, as the iOpener cools, reheat it in the microwave for an additional thirty seconds at a time.
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Remove the iOpener from the microwave, holding it by one of the two flat ends to avoid the hot center.
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Fill a pot or pan with enough water to fully submerge an iOpener.
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Heat the water to a boil. Turn off the heat.
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Place an iOpener into the hot water for 2-3 minutes. Make sure the iOpener is fully submerged in the water.
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Use tongs to extract the heated iOpener from the hot water.
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Thoroughly dry the iOpener with a towel.
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Your iOpener is ready for use! If you need to reheat the iOpener, heat the water to a boil, turn off the heat, and place the iOpener in the water for 2-3 minutes.
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Heat an iOpener and apply it to a long edge of the S8 for about 2 minutes.
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In the following steps you will be cutting through the adhesive around the edge of the rear glass panel.
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The adhesive on the rear case is laid out as seen in the first image.
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The prying pattern as seen from the outside of the phone is as follows:
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Thick portions of adhesive
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Thin areas of adhesive
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Avoid prying here, to protect the fingerprint sensor.
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Once the back panel is warm to the touch, apply a suction cup as close to the heated edge of the phone as you can while avoiding the curved edge.
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Lift on the suction cup, and insert an opening pick under the rear glass.
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Repeat the previous heating and cutting procedure for the remaining three sides of the phone.
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Leave an opening pick on each side as you continue to the next to prevent the adhesive from resealing.
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Use the opening picks to slice through any remaining adhesive and open the phone slightly.
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Remove the glass from the phone.
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Use tweezers to peel away any remaining adhesive from the phone's chassis. Then clean the adhesion areas with high concentration isopropyl alcohol (at least 90%) and a lint-free cloth to prep the surface for the new adhesive.
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Peel the adhesive backing off of the new rear glass, carefully line up one edge of the glass against the phone chassis, and firmly press the glass onto the phone.
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Remove eleven 3.7 mm screws using a Phillips #000 screwdriver.
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Insert a SIM card opening tool into the small hole on the left side of the top edge of the phone.
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Press to eject the tray.
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Remove the SIM card tray from the phone.
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Use the point of a spudger to disconnect two antenna cables that connect the motherboard to the daughterboard.
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Use the flat end of a spudger to disconnect an antenna ribbon cable that connects the motherboard to the daughterboard.
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Use the flat end of a spudger to lift the motherboard and disconnect it from the daughterboard.
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Insert the pointed tip of a spudger into the corner of the sensor array, between the case and the array. Pry up the sensor array.
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Remove the sensor array.
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