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简介

Follow this guide to replace the heat sink on a Nintendo Switch gaming console.

Installation will require the thermal paste to be cleaned off and replaced with new.

  1. Remove the four 6.3mm Tri-point Y00 screws from the rear panel.
    • Remove the four 6.3mm Tri-point Y00 screws from the rear panel.

  2. Remove the single 6.1mm JIS #000 screw from underneath the kickstand.
    • Remove the single 6.1mm JIS #000 screw from underneath the kickstand.

  3. Remove the two 2.7mm JIS #000 screws from the bottom of the device.
    • Remove the two 2.7mm JIS #000 screws from the bottom of the device.

  4. Remove the single 2.7mm JIS #000 screw from the top of the device.
    • Remove the single 2.7mm JIS #000 screw from the top of the device.

  5. Remove the single 3.8mm JIS #0 screw from the right Joy-Con rail. Remove the single 3.8mm JIS #0 screw from the left Joy-Con rail.
    • Remove the single 3.8mm JIS #0 screw from the right Joy-Con rail.

    • Remove the single 3.8mm JIS #0 screw from the left Joy-Con rail.

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  7. Pull the rear panel up and off of the device. Pull the rear panel up and off of the device. Pull the rear panel up and off of the device.
    • Pull the rear panel up and off of the device.

  8. Remove the single 3.1mm JIS #000 screw from micro SD card board.
    • Remove the single 3.1mm JIS #000 screw from micro SD card board.

  9. Lift the micro SD card board up and pull towards you to disconnect it from the motherboard. Lift the micro SD card board up and pull towards you to disconnect it from the motherboard.
    • Lift the micro SD card board up and pull towards you to disconnect it from the motherboard.

  10. Remove the six 3.1mm JIS #000 screws from the shield plate.
    • Remove the six 3.1mm JIS #000 screws from the shield plate.

  11. Remove the shield plate from the device. A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. If needed, during reassembly, use our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro. A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. If needed, during reassembly, use our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro.
    • Remove the shield plate from the device.

    • A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. If needed, during reassembly, use our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro.

  12. Insert the pointed end of a spudger underneath the white connector and pry upwards to disconnect the battery from the motherboard. Insert the pointed end of a spudger underneath the white connector and pry upwards to disconnect the battery from the motherboard.
    • Insert the pointed end of a spudger underneath the white connector and pry upwards to disconnect the battery from the motherboard.

  13. Remove the three 3.1mm JIS #000 screws from the heatsink.
    • Remove the three 3.1mm JIS #000 screws from the heatsink.

  14. Pull the heatsink up 45 degrees and rotate it to the right to remove. Pull the heatsink up 45 degrees and rotate it to the right to remove. Pull the heatsink up 45 degrees and rotate it to the right to remove.
    • Pull the heatsink up 45 degrees and rotate it to the right to remove.

结论

To reassemble your device, follow these instructions in reverse order.

4等其他人完成本指南。

Blake Klein

于2017年01月29日注册

45,095 信誉积分

创作了48篇指南

You're missing the part about the SD card reader I believe. Great teardown though. Also, maybe demonstrate thermal paste spread.

Justin Moll - 回复

Good catch! I’ve updated the guide to include the SD card reader.

Blake Klein -

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