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简介

In this guide you will be removing the back panel and motherboard to access and remove the inside keyboard.

配件

没有特定配件。

  1. Before dissembling your phone, be sure it is powered off to avoid minor electric shock or possible fire. Place the phone facedown on the table. Use your fingernail (or a small screw driver) to pull down the tab below the battery.
    • Before dissembling your phone, be sure it is powered off to avoid minor electric shock or possible fire.

    • Place the phone facedown on the table.

    • Use your fingernail (or a small screw driver) to pull down the tab below the battery.

    • Lift the battery out.

  2. Locate the five rubber covers on the back panel of the phone. Use the metal probe to pop out each rubber cover to reveal the screws underneath.
    • Locate the five rubber covers on the back panel of the phone.

    • Use the metal probe to pop out each rubber cover to reveal the screws underneath.

  3. Locate the six 2.5mm screws on the back panel of the phone. Use a #00 Phillips screwdriver to remove each 2.5mm screw.
    • Locate the six 2.5mm screws on the back panel of the phone.

    • Use a #00 Phillips screwdriver to remove each 2.5mm screw.

  4. Locate the seam around the edge of the phone. Insert the plastic opening tool into the seam and pry gently to release the tabs.
    • Locate the seam around the edge of the phone.

    • Insert the plastic opening tool into the seam and pry gently to release the tabs.

    • Work your way around the phone until all tabs are released.

    • Remove the back panel of the phone.

  5. Locate the silver strip connected to the logic board. The silver strip is closest to the bottom hinge of the phone. Wedge the plastic opening tool in between the silver strip and the logic board. Lift the plastic opening tool to separate the silver strip from the logic board.
    • Locate the silver strip connected to the logic board. The silver strip is closest to the bottom hinge of the phone.

    • Wedge the plastic opening tool in between the silver strip and the logic board.

    • Lift the plastic opening tool to separate the silver strip from the logic board.

  6. Wedge the plastic opening tool in between the logic board and the phone. Lift the plastic opening tool to separate the logic board from the phone.
    • Wedge the plastic opening tool in between the logic board and the phone.

    • Lift the plastic opening tool to separate the logic board from the phone.

  7. Locate the back of the inside keyboard. Take out the inside keyboard. You may need to use your fingernail to pull one of the corners up.
    • Locate the back of the inside keyboard.

    • Take out the inside keyboard. You may need to use your fingernail to pull one of the corners up.

结论

To reassemble your device, follow these instructions in reverse order.

Reed Williston

于2012年09月26日注册

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创作了7篇指南

团队

Cal Poly, Team 16-55, Forte Fall 2012 Cal Poly, Team 16-55, Forte Fall 2012 的会员

CPSU-FORTE-F12S16G55

5 名成员

创作了14篇指南

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