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How to Clean and Apply Thermal Compound

撰写者： Reina Godeck (和另外2个贡献者)
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  • 完成 3

难度

中等

步骤

4

所需时间

建议一个时间??

节

1

标志

1

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  1. Saturate a cotton swab with isopropyl alcohol, and remove the thermal compound from the thermal plates on your component using gentle circular motions.

    • Saturate a cotton swab with isopropyl alcohol, and remove the thermal compound from the thermal plates on your component using gentle circular motions.

    • As the cotton swab becomes saturated with thermal compound, discard and continue with a freshly dipped cotton swab. The compound plate is clean when the cotton swabs come away clean.

    翻译

  2. Repeat the same cleaning process from the previous step on the matching thermal plates on the motherboard. Avoid touching the thermal compound areas once they are clean. Dirt or oil on either surface can disrupt cooling performance and lead to overheating or thermal throttling.

    • Repeat the same cleaning process from the previous step on the matching thermal plates on the motherboard.

    • Avoid touching the thermal compound areas once they are clean. Dirt or oil on either surface can disrupt cooling performance and lead to overheating or thermal throttling.

    翻译

  4. Apply a small amount of thermal compound, about the size of a grain of rice, on the corner of each the cleaned thermal plates on the motherboard. Using a clean plastic card, carefully spread the thermal compound evenly over the surfaces of each thermal plate.

    • Apply a small amount of thermal compound, about the size of a grain of rice, on the corner of each the cleaned thermal plates on the motherboard.

    • Using a clean plastic card, carefully spread the thermal compound evenly over the surfaces of each thermal plate.

    • You need to clean the thermal plates on both the component and the motherboard, but you only need to apply thermal paste on the motherboard thermal plates.

    • Avoid applying too much or too little thermal compound, as it can impede crucial heat transfer. Once spread, the compound should be about as thick as a single sheet of paper.

    翻译

  5. Gently re-seat your component, making sure that the thermal plates align correctly.

    • Gently re-seat your component, making sure that the thermal plates align correctly.

    翻译
结论

Please refer to the previous guide in order to reassemble your device.

3等其他人完成本指南。

作者

与2其他贡献者

Reina Godeck

于2017年10月16日注册

699 信誉积分

创作了5篇指南

徽章: 16

+ 13更多徽章

团队

UW Tacoma, Team S3-G5, Liner Fall 2017 UW Tacoma, Team S3-G5, Liner Fall 2017 的会员

UWT-LINER-F17S3G5

4 名成员

创作了9篇指南

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