简介

This guide will explain step by step how to remove the outer cases of the IBM WorkPad c3.

配件

无需配件。

Turn the device over so that the screen is facing down.
  • Turn the device over so that the screen is facing down.

  • In the next step the device will be heated, so the screen must be turned over to prevent heat damage to the LCD/Digitizer.

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Using a hair dryer, slowly heat the edges of the WorkPad.
  • Using a hair dryer, slowly heat the edges of the WorkPad.

  • Spend at least one minute heating each side of the device. This will melt the glue holding the case together, and allow it to be removed.

  • Be sure not to touch the device directly after heating as it will be extremely hot. Use a towel or oven mitt to grab it.

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  • Use a plastic opening tool to pry the back case from the WorkPad.

  • If the rear cover is not coming off very easily, you probably need to reheat the case in order to sufficiently melt the glue.

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结论

To reassemble your device, follow these instructions in reverse order.

Emily Falkenstein

于2010年10月05日注册

51 信誉积分

创作了5篇指南

团队

Cal Poly, Team 21-35, Regan Fall 2010 Cal Poly, Team 21-35, Regan Fall 2010 的会员

CPSU-REGAN-F10S21G35

3 名成员

创作了5篇指南

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