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苹果的第四代无线键盘 发布于2015年10月 型号A1644

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Desoldering a Broadcom BCM20733 chip

What would be the most cost effective way to desolder a Broadcom BCM20733 chip, without damaging the PCB?

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@dext3r that is a FBGA (Fine Ball Grid Array) chip and just like any BGA has all its connections underneath – the BGA body to PCB gap is less than a millimetre or so. You have to get even heating right under the BGA, a cold spot means a defective joint. So you could try a hot air station but it is unlikely to properly penetrate into the small gaps. I’d suggest to do this with an IR BGA Rework station. That way you can control the heat properly and you could follow the reball profile for it as well. Easier , cleaner and just a higher rate of success. Your personal preference will of course dictate what you are going to use.

Here is the datasheet for all the dimensions etc. CYW20733 Single-Chip Bluetooth Transceiver Wireless Input Devices

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Here’s a bit more on the differences of hot air and IR rework stations Hot Airs vs. IR BGA Rework Stations and here’s an example of one unit PACE - IR 1000 Infrared BGA & SMT Rework Station and the price

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