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当前版本: Kelsea Weber ,

文本:

-Since you got nothing to lose with this board you may try the heat gun method to reflow the BGA. You need to cover the board with two sheets of aluminum foil but before you need to cut a hole to expose the BGA chip. You slowly heat all the board area then concentrate the heat to the BGA. You may put some solder on the chip and when the solder melt on it then you continue to heat a little to be sure that the small solder balls under the chip are melting. Don't heat to much to avoid bridging the solder balls. After it's done don't move the board but let it cool for a while. Maybe you'll have to redo the job until you get a result and maybe you'll ruin the board, it's a guess but good luck and let us know if it worked.
+Since you have nothing to lose with this board, you may try the heat gun method to reflow the BGA.
+
+First you'll need to cut a hole to expose the BGA chip. Then you'll need to cover the board with two sheets of aluminum foil. Slowly heat the entire board area, then concentrate the heat to the BGA. You may put some solder on the chip and when the solder melts on it then you continue to heat a little to be sure that the small solder balls under the chip are melting. '''Don't heat to much to avoid bridging the solder balls'''. After it's done don't move the board but let it cool for a while. You may have to redo the job until you get the result you want.
+
+Good luck and let us know if it worked.

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编辑: lemerise ,

文本:

-Since you got nothing to lose with this board you may try the heat gun method to reflow the BGA. You need to cover the board with two sheets of aluminum foil but before you cut hole in it to expose the BGA chip. You slowly heat all the board area then concentrate the heat to the BGA. You may put some solder on the chip and when the solder melt on it then you continue to heat a little to be sure that the small solder balls under the chip are melting. Don't heat to much to avoid bridging the solder balls. After it's done don't move the board but let it cool for a while. Maybe you'll have to redo the job until you get a result and maybe you'll ruin the board, it's a guess but good luck and let us know if it worked.
+Since you got nothing to lose with this board you may try the heat gun method to reflow the BGA. You need to cover the board with two sheets of aluminum foil but before you need to cut a hole to expose the BGA chip. You slowly heat all the board area then concentrate the heat to the BGA. You may put some solder on the chip and when the solder melt on it then you continue to heat a little to be sure that the small solder balls under the chip are melting. Don't heat to much to avoid bridging the solder balls. After it's done don't move the board but let it cool for a while. Maybe you'll have to redo the job until you get a result and maybe you'll ruin the board, it's a guess but good luck and let us know if it worked.

状态:

open

原帖由: lemerise ,

文本:

Since you got nothing to lose with this board you may try the heat gun method to reflow the BGA. You need to cover the board with two sheets of aluminum foil but before you cut hole in it to expose the BGA chip. You slowly heat all the board area then concentrate the heat to the BGA. You may put some solder on the chip and when the solder melt on it then you continue to heat a little to be sure that the small solder balls under the chip are melting. Don't heat to much to avoid bridging the solder balls. After it's done don't move the board but let it cool for a while. Maybe you'll have to redo the job until you get a result and maybe you'll ruin the board, it's a guess but good luck and let us know if it worked.

状态:

open