Skip to main content
Help

Current version by: chrisronjames.96 ,

Text:

Reballing Will most likely Fix the issue in my my findings . Or You can Rework The APU not With A heatgun tho !. You need Top heat and bottom heat. A Hot plate For bottom heat and a hako Hot air Station. Use AMTECH flux and Add some around the APU. Use a K probe Thermometer with 2 Propes one for bottom heat and one for top heat Tape the probes to the board with thermal tape. Heat the board up with just bottom heat To 180c Then introduce top heat with the hako hot air station at 450c Low air flow setting 3.5. hold the nozzle 2 inches above the APU In a circler motion for about 2mins do let the heat Rise above 225c it will popcorn the APU !2mins. When the temp reaches 220c Very gently Nudge the APU to Unsure the solder has become Molten do not push it Too hard It will cause all the balls to Join together !. Hope this some of you Techs out There
Reballing Will most likely Fix the issue in my my findings . Or You can Rework The APU not With A heatgun tho !. You need Top heat and bottom heat. A Hot plate For bottom heat and a hako Hot air Station. Use AMTECH flux and Add some around the APU. Use a K probe Thermometer with 2 Propes one for bottom heat and one for top heat Tape the probes to the board with thermal tape. Heat the board up with just bottom heat To 180c Then introduce top heat with the hako hot air station at 450c Low air flow setting 3.5. hold the nozzle 2 inches above the APU In a circler motion for about 2mins do let the heat Rise above 225c it will popcorn the APU !2mins. When the temp reaches 220c Very gently Nudge the APU to Unsure the solder has become Molten do not push it Too hard It will cause all the balls to Join together !. Hope this some of you Techs out There

Status:

open

Original post by: chrisronjames.96 ,

Text:

Reballing Will most likely Fix the issue in my my findings . Or You can Rework The APU not With A heatgun tho !. You need Top heat and bottom heat. A Hot plate For bottom heat and a hako Hot air Station. Use AMTECH flux and Add some around the  APU.  Use a K probe Thermometer with 2 Propes one for bottom heat and one for top heat Tape the probes to the board with  thermal tape. Heat the board up with just bottom heat To 180c Then introduce top heat with the hako hot air station at 450c Low air flow  setting 3.5. hold the nozzle 2 inches above the APU In a circler motion for about 2mins do let the heat Rise above 225c it will popcorn the APU ! When the temp reaches 220c Very gently Nudge the APU to Unsure the solder has become Molten do not push it Too hard It will cause all the balls to Join together !. Hope this some of you Techs out There

Status:

open