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当前版本: Keith Hovey ,

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I work for a company where I specialize in asset recovery. I will not name the company but I will give some insight as this has been an issue plaguing PS4 Owners for quite some time.*UPDATED*
I work for a company where I specialize in asset recovery. I will not name the company but I will give some insight as this has been an issue plaguing PS4 Owners for quite some time.*UPDATED*
 
BLOD has a few sources toReball is an unnecessary option for most consoles. If you follow the issue so Im assuming that the console has a self check it does at boot similar to what a PC does when it starts uponline guides and upon an error either it protects its self and shuts off immediately or postssuch (for dealing with HDMI issues) with no video andluck it is stuckmost likely a connection failure in some kinda corner of loop. With that being said.... Sincethe APU, a connection failure on the Network co-processor, or a bad power supply. I say this because when we getremoved the APU on our early test units (and the co-processors as of recently) we used for our research we found that the solder balls in the grid on a few hundredcorners of these a month I looked into itchips were cleanly detached and came up with a solution.oxidized. You can see this for yourself if you ever reball or remove the chips from the board in general.
BLOD has a few sources toReball is an unnecessary option for most consoles. If you follow the issue so Im assuming that the console has a self check it does at boot similar to what a PC does when it starts uponline guides and upon an error either it protects its self and shuts off immediately or postssuch (for dealing with HDMI issues) with no video andluck it is stuckmost likely a connection failure in some kinda corner of loop. With that being said.... Sincethe APU, a connection failure on the Network co-processor, or a bad power supply. I say this because when we getremoved the APU on our early test units (and the co-processors as of recently) we used for our research we found that the solder balls in the grid on a few hundredcorners of these a month I looked into itchips were cleanly detached and came up with a solution.oxidized. You can see this for yourself if you ever reball or remove the chips from the board in general.
 
Reball is an unnecessary option for most consoles. If you follow the online guides and such (for dealing with HDMI issues) with no luck it is most likely a connection failure in a corner of the APU. I say this because when we removed the APU on our early test units we used for our research we found that the solder balls in the grid on a few corners of the APU were cleanly detached from the apu and oxidized. WithWith a sufficient amount of flux applied at 200 Degrees Celsius (which was very little flux by the by) andto each corner and to the edges in between (a little flux really goes a long way) and reflow accomplished at around 225 to 230 celcius we managed to recover around 80%85% of these problematic units. Yes we waited to introduce the flux until the temp hit 200. This200 because when introduced at that temperature most if not all of the flux evaporates very quickly leaving behind nice clean connections. This was able to be done with really low tech equipment. In the end we used a skilletskillet tapped with a few mounts, a heatgun, a non contact thermometer, and a contact thermometer for control to achieve this widespread. We also found that somereflow all of the units did in fact have failed PSU (less than a percent) andboards that some of the units had the same issue at the co-processor or a ram chip (around 10%)needed it.
Reball is an unnecessary option for most consoles. If you follow the online guides and such (for dealing with HDMI issues) with no luck it is most likely a connection failure in a corner of the APU. I say this because when we removed the APU on our early test units we used for our research we found that the solder balls in the grid on a few corners of the APU were cleanly detached from the apu and oxidized. WithWith a sufficient amount of flux applied at 200 Degrees Celsius (which was very little flux by the by) andto each corner and to the edges in between (a little flux really goes a long way) and reflow accomplished at around 225 to 230 celcius we managed to recover around 80%85% of these problematic units. Yes we waited to introduce the flux until the temp hit 200. This200 because when introduced at that temperature most if not all of the flux evaporates very quickly leaving behind nice clean connections. This was able to be done with really low tech equipment. In the end we used a skilletskillet tapped with a few mounts, a heatgun, a non contact thermometer, and a contact thermometer for control to achieve this widespread. We also found that somereflow all of the units did in fact have failed PSU (less than a percent) andboards that some of the units had the same issue at the co-processor or a ram chip (around 10%)needed it.
 
The process of repair now involves changing the psu first, checking the fuses on the board second, if neither fixes the issue or fails the check we reflow the APU and the co-processor. The soak time at 225 is important! No more than just long enough to reflow the grid. Do not exceed 230!!235!! We seem to have mixed results when the co processor is taken past 235 Celcius. May be crappy equipment. The amount of flux is JUST as importantimportant as the temperatures. Just enough to see a little run under the corner of the apuapu and same along the edges. We usually just place a drop from a needle at each point (Corner, Middle of edge, Corner). It is literally just 15 balls max disconnected at sometimes as many as all corners of the APU. Im assuming these are weak points where the flexing of the board and the inflexibility of the apu along with some manufacturer defect end up causing the issue. De-solder an apu and see for yourself! We have also noticed that in rare cases the APU itself is actually warped.
The process of repair now involves changing the psu first, checking the fuses on the board second, if neither fixes the issue or fails the check we reflow the APU and the co-processor. The soak time at 225 is important! No more than just long enough to reflow the grid. Do not exceed 230!!235!! We seem to have mixed results when the co processor is taken past 235 Celcius. May be crappy equipment. The amount of flux is JUST as importantimportant as the temperatures. Just enough to see a little run under the corner of the apuapu and same along the edges. We usually just place a drop from a needle at each point (Corner, Middle of edge, Corner). It is literally just 15 balls max disconnected at sometimes as many as all corners of the APU. Im assuming these are weak points where the flexing of the board and the inflexibility of the apu along with some manufacturer defect end up causing the issue. De-solder an apu and see for yourself! We have also noticed that in rare cases the APU itself is actually warped.

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原帖由: Keith Hovey ,

文本:

I work for a company where I specialize in asset recovery.  I will not name the company but I will give some insight as this has been an issue plaguing PS4 Owners for quite some time.

BLOD has a few sources to the issue so Im assuming that the console has a self check it does at boot similar to what a PC does when it starts up and upon an error either it protects its self and shuts off immediately or posts no video and is stuck in some kind of loop.  With that being said....  Since we get in a few hundred of these a month I looked into it and came up with a solution.

Reball is an unnecessary option for most consoles.   If you follow the online guides and such (for dealing with HDMI issues) with no luck it is most likely a connection failure in a corner of the APU.  I say this because when we removed the APU on our early test units we used for our research we found that the solder balls in the grid on a few corners of the APU were cleanly detached from the apu and oxidized.  With a sufficient amount of flux applied at 200 Degrees Celsius (which was very little flux by the by)  and reflow accomplished at around 225 to 230 celcius we managed to recover around 80% of these problematic units.   Yes we waited to introduce the flux until the temp hit 200.  This was able to be done with really low tech equipment.  In the end we used a skillet, a heatgun, a non contact thermometer,  and a contact thermometer for control to achieve this widespread.  We also found that some of the units did in fact have failed PSU (less than a percent) and that some of the units had the same issue at the co-processor or a ram chip (around 10%).

The process of repair now involves changing the psu first, checking the fuses on the board second, if neither fixes the issue or fails the check we reflow the APU and the co-processor.  The soak time at 225 is important!  No more than just long enough to reflow the grid.  Do not exceed 230!!  The amount of flux is JUST as important.  Just enough to see a little run under the corner of the apu.  It is literally just 15 balls max disconnected at sometimes as many as all corners of the APU.  Im assuming these are weak points where the flexing of the board and the inflexibility of the apu along with some manufacturer defect end up causing the issue.  De-solder an apu and see for yourself!

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open